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Polishing Foam Pad Ø 180 mm Black Waffle

A reticulated waffle shape structured foam pad for hologram removal gives an excellent finishing on both fresh and fully cured paint works. The good balance between elasticity and density in the foam contributes to the final result. The pad is designed to be used in combination with Polarshine® 5 polishing compoundand Polarshine® 3 Antistatic wax. Thickness 25 mm.

Käyttötarkoitus

Kiillotus

Tekniset tiedot

Halkaisija
180 mm
Polishing Foam Pad Ø 180 mm Black WafflePolishing Foam Pad Ø 180 mm Black WafflePolishing Foam Pad Ø 180 mm Black WafflePolishing Foam Pad Ø 180 mm Black WafflePolishing Foam Pad Ø 180 mm Black WafflePolishing Foam Pad Ø 180 mm Black Waffle